Topping Out Completed: Dongchen Electronics Builds a New Industrial Hub

In response to the growing demand for electronic components, Dongchen Electronics started building a new facility and increasing its production capacity. On July 11, the company held a topping-out ceremony for its R&D and Manufacturing Project in the Zhanggong District of Ganzhou, located on Tianlongshan Road.

The main structure of the project has officially been topped out with the completion of the final concrete pour, marking a significant milestone in the construction process.

Now that the structure is complete, the project is entering the interior and equipment installation phase, and full production is expected soon. Building on this momentum, Dongchen Electronics will expand its presence in China, enhance its capabilities, and foster deeper industry collaboration.